
Single-sided black insulating copper foil is a composite functional material based on an ultra-thin metal substrate. Its structural design features a black insulating layer coated on one side, while the other side retains the original metallic color. This material possesses multiple characteristics: the black insulating side provides high resistivity to block current conduction, preventing circuit short circuits, and at the same time reduces optical reflection; the metal side maintains excellent electrical conductivity and thermal conductivity. The ultra-thin integrated structure is achieved through a precision coating process, exhibiting excellent performance in flexibility, processability (supporting die cutting/laser cutting) and environmental adaptability (temperature resistance from -40℃ to 400℃, flame retardancy meeting UL94V0 standard, and compliance with RoHS). It provides a synergistic solution for electromagnetic shielding, insulation protection and thermal management in electronic devices.

Single-sided black conductive copper foil is a composite functional material based on metal copper foil, with an ingenious structural design: one side retains the original metallic color, while the other side is covered with a special black conductive layer. This material usually adopts advanced roll-to-roll sputtering technology or nano-coating technology to realize functional coatings on ultra-thin metal substrates. In terms of thickness control, the material has broken through key technical bottlenecks, and the copper foil can be customized to specifications of less than 27μm. At the same time, through precision manufacturing processes, the material maintains excellent physical properties even in an ultra-thin state. In terms of surface characteristics, the material has double-sided conductivity. The surface resistance of the black side is strictly controlled at an extremely low level of ≤0.05Ω, ensuring excellent current conduction and electromagnetic shielding performance. The metallic original color side presents high gloss, and the color difference can be adjusted through customized production processes to meet the strict requirements for appearance aesthetics of various high-end electronic devices. The overall structural design of the material is scientific and reasonable, usually including three functional layers: a metal substrate layer (providing mechanical support and basic thermal conductivity), a black conductive layer (realizing EMI shielding and thermal radiation), and an optional adhesive layer (facilitating installation and fixation). The multi-layer structure works synergistically to endow the material with comprehensive performance advantages.
